Microballs
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Ningbo S J Electronics Co., Ltd.'s high precision solder ball products can be used in many different package applications, such as Flip Chip interconnects, BGA interconnects, as well as CSP interconnects, etc. The precision solder balls can be made in different compositions and sizes based on customer's requirements. We produce micro balls with diameter <100um, with low surface oxidation and low-alpha. In the application of Flip Chip interconnects, micro-balls can be attached to substrate first, then makes joints with Cu bumps on the Si die through Flip Chip reflow. For BGA packages, the solder balls are attached to packages, then reflow onto the PCB board with pre-printed solder paste.
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