Products
Ningbo S J Electronics Co., Ltd.'s high precision solder ball products can be used in many different package applications, such as Flip Chip interconnects, BGA interconnects, as well as CSP interconnects, etc.
The precision solder balls can be made in different compositions and sizes based on customer's requirements. We produce micro balls with diameter <100um, with low surface oxidation and low-alpha.
In the application of Flip Chip interconnects, micro-balls can be attached to substrate first, then makes joints with Cu bumps on the Si die through Flip Chip reflow. For BGA packages, the solder balls are attached to packages, then reflow onto the PCB board with pre-printed solder paste.
Lead-free SAC305 alloy, compliant with RoHS and REACH requirements, is commonly used in electronic devices.
SJ SAC305 preforms are compatible with existing electronic packaging manufacturing devices and processes.
Intergrated Heat Spreader (IHS)
S J Electronics offers high-end integrated head spreaders (IHS) with superior precision and quality. These precision-engineered, high-end integrated heat spreader are offered in 37.5 mm x 37.5 mm with nickel plated, or 72mm x 55mm, with nickel / gold plating on the surface.
Our IHS can achieve Thermal conductivity greater than >400W/(m.k) with customization into lid-type, hat-type or stiffener ring.
S J Electronics high precision Indium preform products are uniquely developed as thermal interface materials (TIM1) for CPU packages. Thermal conductivity is > 80 W/(m.k).
During package assembly, in order to achieve the best interface thermal conductivity, a thin wetting metal layer is needed on the back side of the die to wet the Indium preform, and connect to I H S (Integrated Heat Spreader). At the same time, using appropriate flux to make sure Indium covering all of the die surface during reflow process without internal and interfaces voids to ensure most effective interface heat transfer.
