Tin Based Solder Preform
Tin Based Solder Preform:
Lead-free SAC305 alloy, compliant with RoHS and REACH requirements, is commonly used in electronic devices.
SJ SAC305 preforms are compatible with existing electronic packaging manufacturing devices and processes.
Active Solder Preform:
Lead-free SAC305 alloy, compliant with RoHS and REACH requirements, is commonly used in electronic devices.
SJ Active SAC305 preform is uniquely designed to eliminate the need to use chemical flux/perform reflow in reduction atmosphere to activate the surface during reflow process.
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Product Description
Tin Based Solder Preform:
Lead-free SAC305 alloy, compliant with RoHS and REACH requirements, is commonly used in electronic devices.
SJ SAC305 preforms are compatible with existing electronic packaging manufacturing devices and processes.
Active Solder Preform:
Lead-free SAC305 alloy, compliant with RoHS and REACH requirements, is commonly used in electronic devices.
SJ Active SAC305 preform is uniquely designed to eliminate the need to use chemical flux/perform reflow in reduction atmosphere to activate the surface during reflow process.
The company focuses on the field of high-end packaging materials for integrated circuits, with the vision of "creating high-quality core materials and enhancing human experience", and actively creates an international integrated service provider of core packaging materials, technology and supporting equipment for high-power chips (CPU, GPU, 5G base station, AI, etc.).
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Tin Based Solder Preform
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