Indium Preform
SJ Gen1 Indium Preform:
S J Electronics high precision Indium preform products are uniquely developed as thermal interface materials (TIM1) for CPU packages. Thermal conductivity is > 80 W/(m.k).
During package assembly, in order to achieve the best interface thermal conductivity, a thin wetting metal layer is needed on the back side of the die to wet the Indium preform, and connect to I H S (Integrated Heat Spreader). At the same time, using appropriate flux to make sure Indium covering all of the die surface during reflow process without internal and interfaces voids to ensure most effective interface heat transfer.
SJ Gen2 Indium Preform:
S J Electronics ’s high precision Indium preform products are uniquely developed as thermal interface materials (TIM1) for CPU packages. The application without flux making it an excellent solution for BGA reflow.
SJ Gen2 Indium Preform is uniquely designed to eliminate the
need for using chemical flux to activate the surface during reflow
process.
Category:
Product Description
SJ Gen1 Indium Preform:
S J Electronics high precision Indium preform products are uniquely developed as thermal interface materials (TIM1) for CPU packages. Thermal conductivity is > 80 W/(m.k).
During package assembly, in order to achieve the best interface thermal conductivity, a thin wetting metal layer is needed on the back side of the die to wet the Indium preform, and connect to I H S (Integrated Heat Spreader). At the same time, using appropriate flux to make sure Indium covering all of the die surface during reflow process without internal and interfaces voids to ensure most effective interface heat transfer.
SJ Gen2 Indium Preform:
S J Electronics ’s high precision Indium preform products are uniquely developed as thermal interface materials (TIM1) for CPU packages. The application without flux making it an excellent solution for BGA reflow.
SJ Gen2 Indium Preform is uniquely designed to eliminate the
need for using chemical flux to activate the surface during reflow
process.
The company focuses on the field of high-end packaging materials for integrated circuits, with the vision of "creating high-quality core materials and enhancing human experience", and actively creates an international integrated service provider of core packaging materials, technology and supporting equipment for high-power chips (CPU, GPU, 5G base station, AI, etc.).
Key words:
SJ Gen1 Indium Preform
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