SJ Gen1 Indium Preform
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S J Electronics high precision Indium preform products are uniquely developed as thermal interface materials (TIM1) for CPU packages. Thermal conductivity is > 80 W/(m.k). During package assembly, in order to achieve the best interface thermal conductivity, a thin wetting metal layer is needed on the back side of the die to wet the Indium preform, and connect to I H S (Integrated Heat Spreader). At the same time, using appropriate flux to make sure Indium covering all of the die surface during reflow process without internal and interfaces voids to ensure most effective interface heat transfer.
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