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R&D, Manufacturing and Sales

(Summary description)R&D, manufacture and sale of various materials for CPU/GPU semiconductor packaging, such as micro-solder balls for high reliability packaging (Flip Chip, BGA, etc.), TIM1 high thermal conductivity, heat spreader, etc.

R&D, Manufacturing and Sales

(Summary description)R&D, manufacture and sale of various materials for CPU/GPU semiconductor packaging, such as micro-solder balls for high reliability packaging (Flip Chip, BGA, etc.), TIM1 high thermal conductivity, heat spreader, etc.

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R&D, manufacture and sale of various materials for CPU/GPU semiconductor packaging, such as micro-solder balls for high reliability packaging (Flip Chip, BGA, etc.), TIM1 high thermal conductivity, heat spreader, etc.

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