Talent Idea

The company has successfully built a R&D team in the United States from new material design, equipment design, manufacturing to material production process. This team has laid the foundation for the manufacture of CPU/GPU high thermal conductivity TIM1 materials and high reliability precision micro-welding balls. The team will return home one after another and land in Beilun, Ningbo.
Within three years, the Ningbo team has expanded to 50 people and trained a group of elites in the industry. Among them, 20 are the backbone of technology research and development, 30 are the backbone of technology management, which integrates production, management and quality control capabilities. Within five years, the team has expanded to 200 people and trained the packaging technology and management talents of high-end server chips. Enough to have a driving impact on the domestic chip packaging industry.